Chip Scale Packaging


(CSP) A type of surface mount integrated circuit packaging that provides pre-speed-sorted, pre-tested and pre-packaged die without requiring special testing. An example is Motorola's Micro SMT packaging.

See also: chip-on-board, flip chip, multichip module, known good die, ball grid array.

["Chip scale packaging gains at SMI. (Surface Mount International)", Bernard Levine, Electronic News (1991), Sept 4, 1995 v41 n2081 p1(2)].

Last updated: 2006-08-14

Nearby terms:

Chip JewelryChip Scale Packagingchip setChips & Technologies

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