Dual In-Line Package from FOLDOC

Dual In-Line Package

(DIL, DIP) The most common type of package for small and medium scale integrated circuits, with up to about 48 pins. The pins hang vertically from the two long edges of the rectangular package, spaced at intervals of 0.1 inch. The pins fit through holes in the circuit board to which they are soldered or into a socket.

[More than 48 pins?]

Last updated: 1995-02-06

Nearby terms:

Dual In-line Memory Module ♦ Dual In-Line Package ♦ dual ported

Try this search on Wikipedia, Wiktionary, Google, OneLook.