Plastic Pin Grid ArrayPin Grid Array packaging is similar to that used on Pentium processors. The silicon core is covered by a heat slug that faces down toward the motherboard. The Celeron 300A to the 533 use a PPGA package. The Celeron 566 onward use a FC-PGA package. Celeron processors are also available in Slot 1 SEPP packaging.
Last updated: 2000-08-26